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FOR IMMEDIATE RELEASE |
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| Contact:
Sharon Grace TIA 703. 907.7721 sgrace@tiaonline.org |
Contact:Mary
Beth Koelling OSP EXPO 847.462.5783 marybeth@pracom.com |
Leading Telecom Service Provider Executives Dominate GLOBALCOMM™ 2006 Speaker Lineup CXOs from Mundivox, Orange, SBC and Telecom Italia to Offer Global Industry
Perspectives |
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| Arlington, Va. -- The Telecommunications Industry Association
(TIA), owner and organizer of GLOBALCOMM™, today announced a stellar
lineup of top executives from worldwide service providers to address
20,000 delegates at its 2006 debut event. Speakers include Alberto Duran,
founder and CEO, Mundivox Communications; Sanjiv Ahuja, CEO, Orange;
John T. Stankey, CTO, SBC; and Stefano Pileri, CTO, Telecom Italia. GLOBALCOMM,
the next-generation communications marketplace and summit, will be held
June 4-8, 2006, at Chicago's McCormick Place. For TIA, GLOBALCOMM replaces
SUPERCOMM® as TIA's annual ICT industry event. The association managed
SUPERCOMM since its inception in 1988. SBC CTO John T. Stankey will participate in a keynote session jointly organized by TIA and OSP EXPO. In 2006, OSP EXPO will be co-located with GLOBALCOMM creating comprehensive exhibits featuring the latest communications solutions from network convergence to end-user deployment. OSP EXPO, the industry leader in telecom network education, will bring together OSP professionals from the ILEC, IOC and CLEC communities delivering over 250 of the latest OSP technologies, 50+ regular and advanced seminars offering attendees the opportunity to receive continuing education credits, and powerful keynotes by top SBC executives. The robust educational lineup will focus on DSL, fiber optics, triple play deployments, OSP emerging technologies and much more. This service provider lineup is just a glimpse of the world-class speaker program planned for GLOBALCOMM 2006. The event will provide attendees with a comprehensive view of the global information and communications technology (ICT) marketplace. The conference program will include a series of GLOBALCOMM Summits, produced by TIA, focusing on the Americas, Europe-Middle East-Africa, and Asia-Pacific, as well as an Innovations Summit -- the latter featuring presentations by new and emerging technology companies. In addition, TIA, organizer of the Supplier Diversity summits held at SUPERCOMM, will produce a new TIA Supplier Diversity Summit at GLOBALCOMM. Industry topics scheduled for GLOBALCOMM 2006 conferences will range from global business opportunities, Internet protocol (IP) video and voice over IP, to enterprise communications solutions, next-generation networks, wireless broadband, IMS, standards, wireless, broadband, regulations and ICT vendor/customer case studies. GLOBALCOMM™ 2006 will also feature 450 exhibitors, free keynote addresses and panels, paid conferences by the International Engineering Consortium and other organizations, and co-location with OSP EXPO, the Outside Plant Exposition and Conference. More than 80 percent of the 200,000 net-square-foot exhibition has been sold, showcasing global ICT solutions. ### About TIA About GLOBALCOMM™ About OSP EXPO SUPERCOMM® is a registered trademark of the Telecommunications Industry Association (TIA) and the United States Telecom Association (USTA). The final SUPERCOMM® was held in June 2005. |
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